Microscope image of electromigration-induced hillock and void

Electromigration protection requires accurate interconnect modeling - Design with Calibre

In situ synchrotron study of electromigration induced grain rotations in Sn solder joints

Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects (Chapter 3) - Electromigration in Metals

Electromigration (all content)

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Effects of an interfacial layer on stress relaxation mechanisms active in the Cu–Si thin film system during thermal cycling, MRS Communications

The electromigration effect revisited: non-uniform local tensile stress-driven diffusion

PDF) In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

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In-Situ Observation and Quantitative Analysis of Electromigration Void Dynamics

Electromigration in Metallic Materials and Its Role in Whiskering - ScienceDirect

Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study - ScienceDirect